We connect multimodal sensor interfaces, mixed-signal ICs, and intelligent interaction to create practical sensing experiences across emerging device form factors.
01020304
01
FLEXIBLE DISPLAYDDI · TDDI / 01
DISPLAY · DDI · TDDI
Next-Generation Flexible Display Driver System
Driver IC architectures for foldable, rollable, and stretchable OLED displays
TDDI integration of display driving with touch, stylus, and pressure sensing
Low-power compensation for panel non-uniformity, IR drop, and variable refresh rate
02
SENSING PLATFORMWEARABLE / 02
WEARABLE SENSING
Integrated Wearable Sensor Platform
Unified pressure, biosignal, triboelectric, and bezel-touch sensing
ECG, SpO₂, and body-temperature monitoring
Bezel touch, rotation, and haptic interaction
03
MULTIMODAL UXTWS · XR / 03
TWS · XR · ON-DEVICE AI
Next-Generation Interaction for TWS / XR
Pressure, tap, and haptic control for TWS earbuds
Multi-level side pressure and slide input for XR / AI glasses
Hands-free multimodal interaction with on-device AI
04
FORM FACTORMOBILE / 04
MOBILE INTERACTION
AI-Enabled Foldable Smartphone UX
Side-button pressure recognition for media and scrolling controls
Multi-level pressure: Soft / Medium / Hard / Extra
Context-aware UX for swipe, scroll, and playback
SENSOR INTERFACESFROM PHYSICAL SIGNALS TO INTELLIGENT INTERACTION
ACTIVE & RECENT PROJECTS
Research Programs
현재 수행 중인 대학·기업 과제와 최근 종료된 기업 연구·사업화 과제를 구분해 소개합니다.